Chapter 1011 The intention of kidnapping arises

"The future of silicon-based semiconductors is predictable, but our previous investment cannot be shelved, so we have not stopped pursuing the pursuit of further reducing the failure rate while maintaining device characteristics.

As a technology supplier, we are always looking for ways to achieve higher performance with new equipment, and we are also adjusting our fab manufacturing processes.

In the wafer fab, we use many innovative process steps for planar gate and trench gate power. Innovation means many errors and difficulty in compatibility. Sometimes a difference in one technical point can cause the entire wafer to fail.

Circle scrapped.

For example, thicker, more lightly doped stacks support higher breakdown voltages but increase on-resistance.

Therefore, in order to form trenches on the device, in some cases, the trench size has been reduced to 1 μm (micron) or even smaller.

To form the trenches, we must deposit another mask layer over the device and inject dopants into it.

The trenches are patterned, then etched, and the source and drain are formed as the trenches are filled with gate material.

Each of these steps is extremely important. What we need to thank is the technical support provided by our official etching research institute in Daxia, which allows us to use the world's top etching technology."

From wafer to wafer cutting, etching, photolithography, chip making, and later, Gu Qing even explained to the executives of these technology companies the direction and specific solutions of his Jiuzhou Technology Company to solve some semiconductor chip problems.

“The so-called 3D chips in the West are actually the same thing as our previous stacked chips. It’s like stacking up the chips layer by layer like building a house, from a set of bungalows to a multi-story residential building.

There is a limit to what a chip can do, and its performance is fixed. If multiple chips are installed flatly, although the performance of the overall processor can be improved, it will cause the chip template area of ​​the core of the processor to be excessive.

It is large and has too many wire interfaces, which can easily cause malfunctions.

The 3D stereo chip and our stacking chip can stack the chips one by one to achieve more powerful performance in the same area.

However, this technology will make the chip heat dissipation problem extremely difficult to solve. Once there is a problem with the chip, the processor must be replaced. There is no possibility for consumers to replace a single chip.

Moreover, the 3D stacked structure of the processor also puts a great test on the stability of the semiconductor chip. During installation and use, a bump or shake may cause chip failure.

Our company's semiconductor engineers have studied the chip technology developed by Western technology companies. The silicon-based semiconductor technology we are cooperating with this time is fully capable of stacking chip technology, and can basically produce chips that are at least three generations ahead of Western technology companies.

chip products.

If partners want to further participate on their own, they can also contact and communicate with other upstream and downstream technology companies that use our technology to develop their own structures and designs. Although very powerful chips will not be produced in the short term, as long as they master the rules and methods

, then it is completely possible to replace the structure once every three years, or even upgrade the structure once every two years.

But I still hope that the partners can be good students first, study hard, and then have enough foundation and experience to conduct research and development and design on their own. Moreover, the project of designing chips also requires a strong enough team of engineers to complete.

At present, domestic and foreign enterprises, research institutions and even official organizations have an extremely strong desire for students, tutors, and working staff in this industry.

Friends who have ideas about this project, it is best to contact domestic universities to communicate clearly. After all, it is impossible for our company's technology to be transferred abroad without passing the application review and approval, even to the overseas branches of domestic companies.

Those who master our company’s technology need to report and apply every time.”

Frankly speaking, Gu Qing was very serious about what he said. It can even be said that he did not hide any secrets in many projects. Not only did he clearly explain the technical advantages and disadvantages, but he also made the particularities of the project clear and transparent.

When a group of technology company executives heard what happened, the mountains and rivers between their eyebrows were no longer ugly, but extremely twisted and weird.

Everyone knows that Jiuzhou Technology has close cooperation with the government, but how did Jiuzhou Technology come up with so many technically sensitive points and prohibited projects? You even asked the government to set up a special department to manage them?

Which of the companies present, Xia Wei, BYD, and Ningde, does not cooperate with the government? Which one is not a famous presence in the industry?

But the cooperation was so close that they even uploaded some core systems to the official platform, just like that, but there was no technical support and technical protection like Jiuzhou Technology!

Yu Chengdong took a deep breath, pinched his nose with his right hand, and narrowed his eyes slightly.

His own Kirin chip used to use a structure that was optimized and developed based on the ARM architecture. Later, he learned the chip structure of Jiuzhou Technology, but so far, Xia Wei still has not "learned from the master".

Only by entering the world of Kyushu's semiconductor field can we understand how terrifying Kyushu technology is.

The young man in front of me actually supported the semiconductor department to develop chips directly from the bottom. Not only did he abandon the MIPS instruction set, he also developed his own instruction set architecture, self-developed AI processor, self-developed program software, and even designed and developed the production process.

Industrial software platform and intelligent AI assistance.

As scary as it is, Jiuzhou Technology also has the most powerful robotic arms and process manufacturing dust-free workshops in the industry!

These technologies are extremely important not only for the semiconductor chip industry, but also for the production and research and development of other high-tech products.

And those semiconductor switching components…

In a sea of ​​hundreds of millions of transistors, small switches are made accurately.

Even though Gu Qing introduced that there is not much difference in the internal architecture and technical directions between the chips produced by Jiuzhou Technology and the 3D chips developed by Western technology companies, they both build a sufficiently powerful performance architecture by changing the arrangement and structure of countless transistors inside the chip, improving performance.

Computing performance.

But the data comparison of sorting and structure, optimization operation and energy consumption ratio are too powerful, right?

If we go by the data given by Zhao Qing, as long as we use Kyushu Semiconductor's technology and carefully engage in chip research and development, we can develop a chip that is twice as powerful as Pingguo's latest chip in up to two years!

When the time comes, we will move the self-developed chips to the 3D structure, and there will be another terrible performance improvement!

At this moment, Yu Chengdong really had the urge to kidnap Gu Qing.
Chapter completed!